Semiconductor－AOI and measurement Series
AOI Machine (Six Sides)
Specification
This machine is applied for semiconductor packaging process and mainly used for the final products' appearance inspection.
Features
- High-precision X/Y/Z Positioning ±002mm.
- Capable of inspecting BGA 120mm x 120mm and as small as >30um.
- Capable of inspecting the substrate /tinning ball /die /passive component and heat sinker.
- Special multi-angle light source method for various types of defects.
- Optional customized GUI/HMI and SECS/GEM function.
- Capable of integration of software and generate reports.