Semiconductor－AOI and measurement Series
AOI Machine (Solder Balling)
Specification
This machine is applied for semiconductor packaging process and mainly used for the quality inspection after ball mounting.
Features
- High-precision X/Y/Z Positioning ±002mm.
- Friendly GUI/HMI.
- Capable of inspecting ball lacking/ bridge/different size.
- Capable of inspecting tinning ball with special light source.
- Optional customized GUI/HMI and SECS/GEM function.
- Capable of integration of loader and unloader for standalone operation.
- Capable of integration of unloader for Bin operation.