Passive Component Process Equipment
Cutting Machine
Specification
This machine is applied for cutting ceramic substrates, MLCC and MLCI of the passive components,available cutting size from 100mm to 160mm.
Features
1.High-speed cutting (8 cutting/sec)
2.High-precision alignment.
3.High-accuracy moving.
4.Quick-release tooling.
5.Friendly GUI/HMI.