Semiconductor－AOI and measurement Series
Wafer AOI machine (after dispensing)
Specification
This machine is applied for semiconductor packaging process of chip quality detection with offline AOI function.
The inspection result will be outputted to computer for sorting out abnormal product before the next process,
which effectively increases the production and yield rate.
Features
- High-precision X/Y/Z Positioning ±0.003mm.
- Friendly GUI/HMI.
- Capable of inspecting broken glue/ glue width/ glue path.
- Capable of inspecting black glue/ white glue with special light source.
- Optional customized GUI/HMI and SECS/GEM function.
- Capable of integrating by load port and robot for standalone operation.