Semiconductor－Bonding Series
Optical Mounter
Specification
This machine is applied for the lamination of OCA and mobile device optical components.
With advanced vision system、rotary tower structure and JEDEC Tray design,which can enhance the production and reduce the operation time at the same time.
Features
1.High UPH: >2000pcs/hr.
2.High-precision alignment ±50um @ 3σ。
3.High flexibility on Bin setting.
4.Customized pump with quick-release design.
5.Reducing operation time with standardized carrier.