Semiconductor－Bonding Series
ACF Mounter
Specification
This machine is applied for CMOS module flex mounting,the main purpose is to align flex and CMOS module by vision system with bonding pressure and temperature control,with the multi-mounting technique the production rate can reach efficient performance,In addition, different carriers are available to be changed for next process.
Features
1.High-accuracy cutting performance.
2.High-precision alignment performance.
3.High-speed positioning performance.
4.High flexibility on tool changing.
5.Friendly GUI/HMI.