Semiconductor－Bonding Series
FPC Mounter
Specification
This machine is applied for flex mounting, enhanced production rate and yield rate with alignment、preheat and AOI system.
Features
1.Dual boat arm design to enhance UPH.
2.Dual CCD alignment to reduce the human error.
3.Capable of accurate lamination with self-developed closed-loop strength control system.
4.High-accuracy and precision performance.
5.High-speed performance.
6.High flexibility on bond tip setting.
7.Friendly GUI/HMI.