Semiconductor－Dispensing Equipment Series
Dispensing Machine
Specification
This machine is applied for semiconductor packaging process such as thermal glue dispensing and vehicle chip.
Machine configuration can be allocated based on manufacturing requirement.
Features
1.Equipped with Linear Motor to ensure high accuracy and speed , positioning repeatability ±2μm.
2.Equipped with dual pump for coating operation (cross function is available).
3.Enhanced production yield with the "on the fly" mode of the alignment system.
4.Optional customized GUI/HMI and SECS/GEM function.