Semiconductor－Dispensing Equipment Series
Wafer level Underfill Dispensing Machine
Specification
This machine is applied for wafer level underfill on semiconductor dispensing packaging process.
By means of the function of optimal route to ensure high performance, equipped with AOI system for the assurance of dispensing quality.
Features
1.Capable of the underfill process such as InFO、CoWoS、FCCSP、FCBGA.
2.Available to be equipped with pneumatic、piezoelectric jetting pump.
3.Friendly GUI/HMI.
4.Enhanced production yield with the "on the fly" mode of the alignment system.