High-Precision Thermal Compression for Advanced Packaging Performance
With the rapid growth of AI and high-performance computing (HPC), increasing chip power density has made thermal management and package reliability critical challenges.
Thermal Compression Bonding (TCB) enables high-quality bonding between chips, thermal interface materials (TIM), and package structures through precise control of pressure, temperature, and time, making it a key process in advanced packaging.
Compared to conventional reflow processes, TCB effectively reduces interfacial voids, improves bonding uniformity, and enhances thermal conductivity, making it ideal for high-power and high-density applications.
🔷 High-Precision Process Control
- Independent control of pressure, temperature, and bonding time
- Micron-level bonding accuracy
- Support for high-pressure applications (up to 200 kg level)
🔷 Multi-Material Integration Capability
- Compatible with Film TIM, Metal TIM, and other materials
- Adaptable to various material properties and package structures
- Stable and consistent bonding quality
🔷 Process Stability & Yield Enhancement
- Effective void control at bonding interfaces
- Improved bonding uniformity and interface reliability
- Consistent and repeatable performance for volume production
🔷 Integrated System for Production Efficiency
- Integrated process design for improved line efficiency
- Multi-process integration within a single platform
- Support for large package sizes
