High-Precision Optical Coupling Technology Enabling Next-Generation Photonic Integration

As data transmission demands continue to grow rapidly, traditional electrical interconnects are increasingly constrained by bandwidth and power consumption limitations. Optical communication technologies are therefore becoming essential for high-performance computing (HPC) and next-generation data center architectures.

Co-Packaged Optics (CPO) integrates optical components directly with semiconductor packaging, enabling high bandwidth, low latency, and energy-efficient system performance.

Within the CPO process, optical coupling technology plays a critical role. The core lies in enabling high-precision alignment and stable coupling between optical components, directly impacting signal transmission efficiency and overall system performance.

🔷 High-Precision Active Optical Coupling

The system utilizes a high-precision 6-axis motion platform combined with real-time optical power feedback to achieve dynamic active alignment, ensuring optimal coupling efficiency.

• 6-axis robotic control (X/Y/Z + rotational axes)
• Dual-mode alignment strategy (Passive Alignment + Active Alignment)
• Micron-level positioning accuracy (±2.5 µm)
• Millisecond-level optical signal feedback optimization

🔷 Precision Dispensing & Compensation Curing Technology

In optical coupling processes, not only alignment precision but also adhesive control and curing compensation are critical to yield performance.

• Dispensing accuracy up to ±5 nL
• Automatic adhesive thickness compensation based on coupling offset
• Adjustable UV curing power with intelligent compensation
• Effective suppression of optical axis shift caused by curing shrinkage

🔷 Real-Time Optical Verification & Closed-Loop Process Control

Each component is verified immediately after coupling through optical signal inspection to ensure compliance before proceeding to the next process.

• Real-time optical power measurement
• Insertion Loss (IL) verification
• Customizable pass/fail criteria
• Support for process data feedback and optimization

🔷 Precision Handling of Heterogeneous Materials

To accommodate various material characteristics such as glass, silicon, and ceramics, the system incorporates dedicated handling and process control mechanisms.

• Customized nozzle design
• Pressure sensing to prevent material damage
• Adaptation to high-fragility and diverse structures
• Enhanced process stability and production yield

🔷 Integrated Optical Coupling Process Platform

The system integrates the complete coupling workflow into a single platform, covering positioning, handling, alignment, dispensing, and verification.

• Vision alignment (Top & Bottom CCD)
• Precision handling (customized nozzles)
• Active alignment (6-axis + optical feedback)
• Dispensing and UV curing (compensation control)
• Optical verification (Insertion Loss testing)